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    2. Group Structure

      • ASM Pacific Technology
          • Wire bonders
          • Die bonders
          • Encapsulation solutions
          • Test handlers
          • Clip bonders,
          • CIS ?equipment
          • TCB bonders
          • Flip chip bonders
          • Mold Under Fill (MUF)
          • Panel molding
          • Laser grooving and dicing
          • Leadframes
          • Advanced packaging materials (molded interconnect substrates)
          • Assembly line solutions
          • DEK printing systems
          • SIPLACE placement systems
          • ASM smart factory tools & services
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